Vulnerabilities > Qualcomm > Sa6155P Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2025-03-03 | CVE-2024-43057 | Use After Free vulnerability in Qualcomm products Memory corruption while processing command in Glink linux. | 7.8 |
| 2025-03-03 | CVE-2024-43060 | Use of Out-of-range Pointer Offset vulnerability in Qualcomm products Memory corruption during voice activation, when sound model parameters are loaded from HLOS to ADSP. | 7.8 |
| 2025-03-03 | CVE-2024-43061 | Use After Free vulnerability in Qualcomm products Memory corruption during voice activation, when sound model parameters are loaded from HLOS, and the received sound model list is empty in HLOS drive. | 7.8 |
| 2025-03-03 | CVE-2024-53014 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption may occur while validating ports and channels in Audio driver. | 7.8 |
| 2025-03-03 | CVE-2024-53023 | Use After Free vulnerability in Qualcomm products Memory corruption may occur while accessing a variable during extended back to back tests. | 7.8 |
| 2025-03-03 | CVE-2024-53024 | NULL Pointer Dereference vulnerability in Qualcomm products Memory corruption in display driver while detaching a device. | 7.8 |
| 2025-03-03 | CVE-2024-53027 | Classic Buffer Overflow vulnerability in Qualcomm products Transient DOS may occur while processing the country IE. | 7.5 |
| 2025-03-03 | CVE-2024-53028 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption may occur while processing message from frontend during allocation. | 7.0 |
| 2025-03-03 | CVE-2024-53030 | Improper Input Validation vulnerability in Qualcomm products Memory corruption while processing input message passed from FE driver. | 7.8 |
| 2025-03-03 | CVE-2025-21424 | Use After Free vulnerability in Qualcomm products Memory corruption while calling the NPU driver APIs concurrently. | 7.8 |