Vulnerabilities > Qualcomm > Sa6145P Firmware > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-06-09 | CVE-2020-11160 | Integer Overflow or Wraparound vulnerability in Qualcomm products Resource leakage issue during dci client registration due to reference count is not decremented if dci client registration fails in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.7 |
| 2021-05-07 | CVE-2020-11293 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound read can happen in Widevine TA while copying data to buffer from user data due to lack of check of buffer length received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.0 |
| 2021-05-07 | CVE-2021-1906 | Improper Handling of Exceptional Conditions vulnerability in Qualcomm products Improper handling of address deregistration on failure can lead to new GPU address allocation failure. | 5.5 |
| 2021-04-07 | CVE-2020-11252 | Out-of-bounds Read vulnerability in Qualcomm products Trustzone initialization code will disable xPU`s when memory dumps are enabled and lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 5.5 |
| 2021-03-17 | CVE-2020-11308 | Improper Validation of Array Index vulnerability in Qualcomm products Buffer overflow occurs when trying to convert ASCII string to Unicode string if the actual size is more than required in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 6.8 |
| 2021-03-17 | CVE-2020-11230 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Potential arbitrary memory corruption when the qseecom driver updates ion physical addresses in the buffer as it exposes a physical address to user land in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 6.4 |
| 2021-02-22 | CVE-2020-3664 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound read access in hypervisor due to an invalid read access attempt by passing invalid addresses in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 6.0 |
| 2021-02-22 | CVE-2020-11198 | Improper Cross-boundary Removal of Sensitive Data vulnerability in Qualcomm products Key material used for TZ diag buffer encryption and other data related to log buffer is not wiped securely due to improper usage of memset in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 6.7 |
| 2020-11-12 | CVE-2020-11209 | Incorrect Authorization vulnerability in Qualcomm products Improper authorization in DSP process could allow unauthorized users to downgrade the library versions in SD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA6155P, SD855, SD 675, SD660, SD429, SD439 | 5.5 |
| 2020-11-12 | CVE-2020-11123 | Unspecified vulnerability in Qualcomm products u'information disclosure in gatekeeper trustzone implementation as the throttling mechanism to prevent brute force attempts at getting user`s lock-screen password can be bypassed by performing the standard gatekeeper operations.' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8009W, APQ8017, APQ8037, APQ8053, APQ8064AU, APQ8096, APQ8096AU, APQ8096SG, APQ8098, MDM8207, MDM9150, MDM9205, MDM9206, MDM9207, MDM9250, MDM9607, MDM9628, MDM9640, MDM9650, MDM9655, MSM8108, MSM8208, MSM8209, MSM8608, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8996SG, MSM8998, QCM4290, QCS405, QCS410, QCS4290, QCS603, QCS605, QCS610, QM215, QSM8250, QSM8350, SA415M, SA515M, SA6145P, SA6150P, SA6155, SA6155P, SA8150P, SA8155, SA8155P, SA8195P, SC7180, SC8180X, SC8180XP, SDA429W, SDA640, SDA660, SDA670, SDA845, SDA855, SDM1000, SDM429, SDM429W, SDM439, SDM450, SDM455, SDM630, SDM632, SDM636, SDM640, SDM660, SDM670, SDM710, SDM712, SDM830, SDM845, SDM850, SDW2500, SDX24, SDX50M, SDX55, SDX55M, SM4125, SM4250, SM4250P, SM6115, SM6115P, SM6125, SM6150, SM6150P, SM6250, SM6250P, SM6350, SM7125, SM7150, SM7150P, SM7225, SM7250, SM7250P, SM8150, SM8150P, SM8250, SM8350, SM8350P, SXR1120, SXR1130, SXR2130, SXR2130P, WCD9330 | 5.5 |