Vulnerabilities > Qualcomm > Sa4155P Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2025-05-06 | CVE-2024-45562 | Use After Free vulnerability in Qualcomm products Memory corruption during concurrent access to server info object due to unprotected critical field. | 7.8 |
| 2025-05-06 | CVE-2024-49844 | Improper Input Validation vulnerability in Qualcomm products Memory corruption while triggering commands in the PlayReady Trusted application. | 7.8 |
| 2025-05-06 | CVE-2025-21453 | Use After Free vulnerability in Qualcomm products Memory corruption while processing a data structure, when an iterator is accessed after it has been removed, potential failures occur. | 7.8 |
| 2025-05-06 | CVE-2025-21462 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while processing an IOCTL request, when buffer significantly exceeds the command argument limit. | 7.8 |
| 2025-05-06 | CVE-2025-21467 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while reading the FW response from the shared queue. | 7.8 |
| 2025-05-06 | CVE-2025-21468 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while reading response from FW, when buffer size is changed by FW while driver is using this size to write null character at the end of buffer. | 7.8 |
| 2025-03-03 | CVE-2024-43051 | Improper Authorization vulnerability in Qualcomm products Information disclosure while deriving keys for a session for any Widevine use case. | 5.5 |
| 2025-03-03 | CVE-2024-53014 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption may occur while validating ports and channels in Audio driver. | 7.8 |
| 2025-03-03 | CVE-2024-53027 | Classic Buffer Overflow vulnerability in Qualcomm products Transient DOS may occur while processing the country IE. | 7.5 |
| 2025-03-03 | CVE-2025-21424 | Use After Free vulnerability in Qualcomm products Memory corruption while calling the NPU driver APIs concurrently. | 7.8 |