Vulnerabilities > Qualcomm > Qualcomm Robotics RB3 Platform Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-09-05 | CVE-2023-28538 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WIN Product while invoking WinAcpi update driver in the UEFI region. | 7.8 |
| 2023-09-05 | CVE-2023-28544 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in WLAN while sending transmit command from HLOS to UTF handlers. | 7.8 |
| 2023-09-05 | CVE-2023-28557 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing command parameters from untrusted WMI payload. | 7.8 |
| 2023-09-05 | CVE-2023-28558 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN handler while processing PhyID in Tx status handler. | 7.8 |
| 2023-09-05 | CVE-2023-28559 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN FW while processing command parameters from untrusted WMI payload. | 7.8 |
| 2023-04-13 | CVE-2022-33269 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption due to integer overflow or wraparound in Core while DDR memory assignment. | 7.8 |
| 2023-04-13 | CVE-2022-33302 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length. | 7.8 |