Vulnerabilities > Qualcomm > Qualcomm Robotics RB3 Platform Firmware

DATE CVE VULNERABILITY TITLE RISK
2023-09-05 CVE-2023-28538 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in WIN Product while invoking WinAcpi update driver in the UEFI region.
local
low complexity
qualcomm CWE-787
7.8
2023-09-05 CVE-2023-28544 Classic Buffer Overflow vulnerability in Qualcomm products
Memory corruption in WLAN while sending transmit command from HLOS to UTF handlers.
local
low complexity
qualcomm CWE-120
7.8
2023-09-05 CVE-2023-28557 Improper Validation of Array Index vulnerability in Qualcomm products
Memory corruption in WLAN HAL while processing command parameters from untrusted WMI payload.
local
low complexity
qualcomm CWE-129
7.8
2023-09-05 CVE-2023-28558 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in WLAN handler while processing PhyID in Tx status handler.
local
low complexity
qualcomm CWE-787
7.8
2023-09-05 CVE-2023-28559 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in WLAN FW while processing command parameters from untrusted WMI payload.
local
low complexity
qualcomm CWE-787
7.8
2023-04-13 CVE-2022-33269 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption due to integer overflow or wraparound in Core while DDR memory assignment.
local
low complexity
qualcomm CWE-190
7.8
2023-04-13 CVE-2022-33302 Improper Validation of Array Index vulnerability in Qualcomm products
Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length.
local
low complexity
qualcomm CWE-129
7.8