Vulnerabilities > Qualcomm > Qualcomm 215 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2019-07-25 | CVE-2019-2236 | NULL Pointer Dereference vulnerability in Qualcomm products Null pointer dereference during secure application termination using specific application ids. | 2.1 |
| 2019-07-25 | CVE-2019-2235 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Buffer overflow occurs when emulated RPMB is used due to sector size assumptions in the TA rollback protection logic. | 4.6 |
| 2019-07-22 | CVE-2019-2287 | Out-of-bounds Write vulnerability in Qualcomm products Improper validation for inputs received from firmware can lead to an out of bound write issue in video driver. | 7.5 |
| 2019-07-22 | CVE-2019-2279 | Out-of-bounds Write vulnerability in Qualcomm products Shared memory gets updated with invalid data and may lead to access beyond the allocated memory. | 7.5 |
| 2019-07-22 | CVE-2019-2261 | Configuration vulnerability in Qualcomm products Unauthorized access from GPU subsystem to HLOS or other non secure subsystem memory can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MSM8996AU, QCA8081, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130 | 4.9 |
| 2019-07-22 | CVE-2019-2260 | Use After Free vulnerability in Qualcomm products A race condition occurs while processing perf-event which can lead to a use after free condition in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 712 / SD 710 / SD 670, SD 730, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, SDX20, SDX24, Snapdragon_High_Med_2016, SXR1130 | 6.9 |
| 2019-07-22 | CVE-2018-13924 | Out-of-bounds Write vulnerability in Qualcomm products Lack of check to prevent the buffer length taking negative values can lead to stack overflow. | 10.0 |
| 2019-07-22 | CVE-2018-13896 | Improper Access Control vulnerability in Qualcomm products XBL_SEC image authentication and other crypto related validations are accessible to a compromised OEM XBL Loader due to missing lock at XBL_SEC stage.. | 7.2 |
| 2019-06-14 | CVE-2018-13907 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products While deserializing any key blob during key operations, buffer overflow could occur, exposing partial key information if any key operations are invoked in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in IPQ4019, IPQ8074, MDM9150, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCA8081, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, SDX20, Snapdragon_High_Med_2016, SXR1130 | 5.0 |
| 2019-06-14 | CVE-2018-13906 | Improper Input Validation vulnerability in Qualcomm products The HMAC authenticating the message from QSEE is vulnerable to timing side channel analysis leading to potentially forged application message in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in IPQ4019, IPQ8074, MDM9150, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCA8081, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, SDX20, Snapdragon_High_Med_2016, SXR1130 | 6.4 |