Vulnerabilities > Qualcomm > Qcs605 Firmware > Medium
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2022-09-16 | CVE-2022-25654 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in kernel due to improper input validation while processing ION commands in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 6.7 |
2022-06-14 | CVE-2021-30349 | Unspecified vulnerability in Qualcomm products Improper access control sequence for AC database after memory allocation can lead to possible memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.7 |
2022-06-14 | CVE-2021-35092 | Improper Input Validation vulnerability in Qualcomm products Processing DCB/AVB algorithm with an invalid queue index from IOCTL request could lead to arbitrary address modification in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 6.7 |
2022-06-14 | CVE-2021-35098 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Improper validation of session id in PCM routing process can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 4.6 |
2022-06-14 | CVE-2021-35116 | Improper Input Validation vulnerability in Qualcomm products APK can load a crafted model into the CDSP which can lead to a compromise of CDSP and other APK`s data executing there in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 6.6 |
2022-06-14 | CVE-2021-35118 | Out-of-bounds Write vulnerability in Qualcomm products An out-of-bounds write can occur due to an incorrect input check in the camera driver in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 4.6 |
2022-06-14 | CVE-2021-35120 | Use After Free vulnerability in Qualcomm products Improper handling between export and release functions on the same handle from client can lead to use after free in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 6.7 |
2022-02-11 | CVE-2021-30309 | Classic Buffer Overflow vulnerability in Qualcomm products Improper size validation of QXDM commands can lead to memory corruption in Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 4.6 |
2022-02-11 | CVE-2021-30318 | Classic Buffer Overflow vulnerability in Qualcomm products Improper validation of input when provisioning the HDCP key can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables | 4.6 |
2022-02-11 | CVE-2021-30324 | Classic Buffer Overflow vulnerability in Qualcomm products Possible out of bound write due to lack of boundary check for the maximum size of buffer when sending a DCI packet to remote process in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 4.6 |