Vulnerabilities > Qualcomm > Qcs605 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-02-22 | CVE-2020-11269 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible memory corruption while processing EAPOL frames due to lack of validation of key length before using it in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 8.8 |
| 2021-02-22 | CVE-2020-11204 | Out-of-bounds Write vulnerability in Qualcomm products Possible memory corruption and information leakage in sub-system due to lack of check for validity and boundary compliance for parameters that are read from shared MSG RAM in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-02-22 | CVE-2020-11203 | Out-of-bounds Write vulnerability in Qualcomm products Stack overflow may occur if GSM/WCDMA broadcast config size received from user is larger than variable length array in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.1 |
| 2021-02-22 | CVE-2020-11195 | Out-of-bounds Write vulnerability in Qualcomm products Out of bound write and read in TA while processing command from NS side due to improper length check on command and response buffers in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 7.8 |
| 2021-02-22 | CVE-2020-11177 | Unspecified vulnerability in Qualcomm products User can overwrite Security Code NV item without knowing current SPC due to improper validation of SPC code setting and device lock in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 8.8 |
| 2021-01-21 | CVE-2020-11119 | Out-of-bounds Read vulnerability in Qualcomm products Buffer over-read can happen when the buffer length received from response handlers is more than the size of the payload in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.5 |
| 2020-11-12 | CVE-2020-11208 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Out of Bound issue in DSP services while processing received arguments due to improper validation of length received as an argument' in SD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA6155P, SD855, SD 675, SD660, SD429, SD439 | 7.8 |
| 2020-11-12 | CVE-2020-11202 | Out-of-bounds Write vulnerability in Qualcomm products Buffer overflow/underflow occurs when typecasting the buffer passed by CPU internally in the library which is not aligned with the actual size of the structure' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in QCM6125, QCS410, QCS603, QCS605, QCS610, QCS6125, SA6145P, SA6155, SA6155P, SA8155, SA8155P, SDA640, SDA670, SDA845, SDM640, SDM670, SDM710, SDM830, SDM845, SDX50M, SDX55, SDX55M, SM6125, SM6150, SM6150P, SM6250, SM6250P, SM7125, SM7150, SM7150P, SM8150, SM8150P | 7.8 |
| 2020-11-12 | CVE-2020-11201 | Improper Input Validation vulnerability in Qualcomm products Arbitrary access to DSP memory due to improper check in loaded library for data received from CPU side' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in QCM6125, QCS410, QCS603, QCS605, QCS610, QCS6125, SA6145P, SA6155, SA6155P, SA8155, SA8155P, SDA640, SDA845, SDM640, SDM830, SDM845, SDX50M, SDX55, SDX55M, SM6125, SM6150, SM6250, SM6250P, SM7125, SM7150, SM7150P, SM8150, SM8150P | 7.8 |
| 2020-11-12 | CVE-2020-11175 | Use After Free vulnerability in Qualcomm products u'Use after free issue in Bluetooth transport driver when a method in the object is accessed after the object has been deleted due to improper timer handling.' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in APQ8009W, MSM8909W, QCS605, QM215, SA6155, SA6155P, SA8155, SA8155P, SDA640, SDA670, SDA855, SDM1000, SDM640, SDM670, SDM710, SDM845, SDX50M, SDX55, SDX55M, SM6125, SM6350, SM7225, SM7250, SM7250P, SM8150, SM8150P, SM8250, SXR1120, SXR1130, SXR2130, SXR2130P | 7.8 |