Vulnerabilities > Qualcomm > Qcs605 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2021-09-17 | CVE-2021-30261 | Improper Input Validation vulnerability in Qualcomm products Possible integer and heap overflow due to lack of input command size validation while handling beacon template update command from HLOS in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
2021-09-09 | CVE-2021-1909 | Classic Buffer Overflow vulnerability in Qualcomm products Buffer overflow occurs in trusted applications due to lack of length check of parameters in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
2021-09-09 | CVE-2021-1933 | Improper Validation of Array Index vulnerability in Qualcomm products UE assertion is possible due to improper validation of invite message with SDP body in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 9.8 |
2021-09-09 | CVE-2021-1934 | Double Free vulnerability in Qualcomm products Possible memory corruption due to improper check when application loader object is explicitly destructed while application is unloading in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT | 7.8 |
2021-09-09 | CVE-2021-1935 | NULL Pointer Dereference vulnerability in Qualcomm products Possible null pointer dereference due to lack of validation check for passed pointer during key import in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 5.5 |
2021-09-09 | CVE-2021-1960 | Improper Input Validation vulnerability in Qualcomm products Improper handling of ASB-C broadcast packets with crafted opcode in LMP can lead to uncontrolled resource consumption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 6.5 |
2021-09-09 | CVE-2021-1961 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to lack of offset length check while updating the buffer value in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.7 |
2021-09-09 | CVE-2021-1962 | Classic Buffer Overflow vulnerability in Qualcomm products Buffer Overflow while processing IOCTL for getting peripheral endpoint information there is no proper validation for input maximum endpoint pair and its size in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.7 |
2021-09-09 | CVE-2021-1974 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer over read due to lack of alignment between map or unmap length of IPA SMMU and WLAN SMMU in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.5 |
2021-09-09 | CVE-2021-30295 | Classic Buffer Overflow vulnerability in Qualcomm products Possible heap overflow due to improper validation of local variable while storing current task information locally in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |