Vulnerabilities > Qualcomm > Qcn7606 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-08-08 | CVE-2023-21626 | Improper Authentication vulnerability in Qualcomm products Cryptographic issue in HLOS due to improper authentication while performing key velocity checks using more than one key. | 7.1 |
| 2023-08-08 | CVE-2023-21651 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Memory Corruption in Core due to incorrect type conversion or cast in secure_io_read/write function in TEE. | 7.8 |
| 2023-08-08 | CVE-2023-21652 | Use of Hard-coded Credentials vulnerability in Qualcomm products Cryptographic issue in HLOS as derived keys used to encrypt/decrypt information is present on stack after use. | 7.1 |
| 2023-08-08 | CVE-2023-28561 | Out-of-bounds Write vulnerability in Qualcomm Qcn7606 Firmware Memory corruption in QESL while processing payload from external ESL device to firmware. | 9.8 |
| 2023-07-04 | CVE-2023-28541 | Out-of-bounds Read vulnerability in Qualcomm products Memory Corruption in Data Modem while processing DMA buffer release event about CFR data. | 7.8 |
| 2023-06-06 | CVE-2022-22076 | Unspecified vulnerability in Qualcomm products information disclosure due to cryptographic issue in Core during RPMB read request. | 5.5 |
| 2023-06-06 | CVE-2022-40507 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in Core while mapping HLOS address to the list. | 7.8 |
| 2023-06-06 | CVE-2022-40523 | Exposure of Resource to Wrong Sphere vulnerability in Qualcomm products Information disclosure in Kernel due to indirect branch misprediction. | 5.5 |
| 2023-06-06 | CVE-2023-21628 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing WMI-UTF command or FTM TLV1 command. | 7.8 |
| 2023-04-13 | CVE-2022-33231 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in core while initializing the encryption key. | 7.8 |