Vulnerabilities > Qualcomm > Qcn7606 Firmware

DATE CVE VULNERABILITY TITLE RISK
2023-12-05 CVE-2023-28550 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in MPP performance while accessing DSM watermark using external memory address.
local
low complexity
qualcomm CWE-787
7.8
2023-12-05 CVE-2023-28585 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Memory corruption while loading an ELF segment in TEE Kernel.
local
low complexity
qualcomm CWE-119
8.8
2023-12-05 CVE-2023-28586 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE.
local
low complexity
qualcomm CWE-119
6.5
2023-12-05 CVE-2023-28587 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in BT controller while parsing debug commands with specific sub-opcodes at HCI interface level.
local
low complexity
qualcomm CWE-787
7.8
2023-12-05 CVE-2023-28588 Integer Overflow or Wraparound vulnerability in Qualcomm products
Transient DOS in Bluetooth Host while rfc slot allocation.
network
low complexity
qualcomm CWE-190
7.5
2023-12-05 CVE-2023-33017 Classic Buffer Overflow vulnerability in Qualcomm products
Memory corruption in Boot while running a ListVars test in UEFI Menu during boot.
local
low complexity
qualcomm CWE-120
7.8
2023-12-05 CVE-2023-33022 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption in HLOS while invoking IOCTL calls from user-space.
local
low complexity
qualcomm CWE-190
7.8
2023-12-05 CVE-2023-33080 Out-of-bounds Read vulnerability in Qualcomm products
Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame.
network
low complexity
qualcomm CWE-125
7.5
2023-12-05 CVE-2023-33088 NULL Pointer Dereference vulnerability in Qualcomm products
Memory corruption when processing cmd parameters while parsing vdev.
local
low complexity
qualcomm CWE-476
7.8
2023-12-05 CVE-2023-33098 Out-of-bounds Read vulnerability in Qualcomm products
Transient DOS while parsing WPA IES, when it is passed with length more than expected size.
network
low complexity
qualcomm CWE-125
7.5