Qcn7606 Firmware

DATE	CVE	VULNERABILITY TITLE	RISK
2020-11-02	CVE-2020-11154	Classic Buffer Overflow vulnerability in Qualcomm products u'Buffer overflow while processing a crafted PDU data packet in bluetooth due to lack of check of buffer size before copying' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8053, QCA6390, QCN7605, QCN7606, SA415M, SA515M, SA6155P, SA8155P, SC8180X, SDX55 low complexity qualcomm CWE-120	8.8
2020-09-08	CVE-2019-10527	Improper Validation of Array Index vulnerability in Qualcomm products u'SMEM partition can be manipulated in case of any compromise on HLOS, thus resulting in access to memory outside of SMEM address range which could lead to memory corruption' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, Bitra, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA4531, QCA6574AU, QCA8081, QCM2150, QCN7605, QCN7606, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA515M, SA6155P, Saipan, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 local low complexity qualcomm CWE-129	7.8
2020-07-30	CVE-2019-14037	Use After Free vulnerability in Qualcomm products Close and bind operations done on a socket can lead to a Use-After-Free condition. local low complexity qualcomm CWE-416	7.8