Vulnerabilities > Qualcomm > Qcn7606 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-01-21 | CVE-2020-11119 | Out-of-bounds Read vulnerability in Qualcomm products Buffer over-read can happen when the buffer length received from response handlers is more than the size of the payload in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.5 |
| 2020-11-02 | CVE-2020-11169 | Integer Overflow or Wraparound vulnerability in Qualcomm products u'Buffer over-read while processing received L2CAP packet due to lack of integer overflow check' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8053, QCA6390, QCN7605, QCN7606, SA415M, SA515M, SA6155P, SA8155P, SC8180X, SDX55 | 9.1 |
| 2020-11-02 | CVE-2020-11155 | Classic Buffer Overflow vulnerability in Qualcomm products u'Buffer overflow while processing PDU packet in bluetooth due to lack of check of buffer length before copying into it.' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8053, QCA6390, QCN7605, QCN7606, SA415M, SA515M, SA6155P, SA8155P, SC8180X, SDX55 | 8.8 |
| 2020-11-02 | CVE-2020-11154 | Classic Buffer Overflow vulnerability in Qualcomm products u'Buffer overflow while processing a crafted PDU data packet in bluetooth due to lack of check of buffer size before copying' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8053, QCA6390, QCN7605, QCN7606, SA415M, SA515M, SA6155P, SA8155P, SC8180X, SDX55 | 8.8 |
| 2020-09-08 | CVE-2019-10527 | Improper Validation of Array Index vulnerability in Qualcomm products u'SMEM partition can be manipulated in case of any compromise on HLOS, thus resulting in access to memory outside of SMEM address range which could lead to memory corruption' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, Bitra, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA4531, QCA6574AU, QCA8081, QCM2150, QCN7605, QCN7606, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA515M, SA6155P, Saipan, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 | 7.8 |
| 2020-07-30 | CVE-2019-14037 | Use After Free vulnerability in Qualcomm products Close and bind operations done on a socket can lead to a Use-After-Free condition. | 7.8 |