Vulnerabilities > Qualcomm > Qcm4325 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-05-02 | CVE-2022-40504 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in Modem when UE received Downlink Data Indication message from the network. | 7.5 |
| 2023-05-02 | CVE-2022-33305 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS due to NULL pointer dereference in Modem while sending invalid messages in DCCH. | 7.5 |
| 2023-04-13 | CVE-2022-33302 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length. | 7.8 |
| 2023-04-13 | CVE-2022-40532 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target. | 7.8 |
| 2023-03-10 | CVE-2022-25655 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in WLAN HAL while arbitrary value is passed in WMI UTF command payload. | 7.8 |
| 2023-03-10 | CVE-2022-25694 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption in Modem due to usage of Out-of-range pointer offset in UIM | 7.8 |
| 2023-03-10 | CVE-2022-25705 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in modem due to integer overflow to buffer overflow while handling APDU response | 7.8 |
| 2023-03-10 | CVE-2022-33213 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in modem due to buffer overflow while processing a PPP packet | 8.8 |
| 2023-03-10 | CVE-2022-33242 | Improper Authentication vulnerability in Qualcomm products Memory corruption due to improper authentication in Qualcomm IPC while loading unsigned lib in audio PD. | 7.8 |
| 2023-03-10 | CVE-2022-33257 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption in Core due to time-of-check time-of-use race condition during dump collection in trust zone. | 7.0 |