Vulnerabilities > Qualcomm > Qca8337 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-02-22 | CVE-2020-11281 | Information Exposure vulnerability in Qualcomm products Allowing RTT frames to be linked with non randomized MAC address by comparing the sequence numbers can lead to information disclosure. | 7.5 |
| 2021-02-22 | CVE-2020-11280 | Reachable Assertion vulnerability in Qualcomm products Denial of service while processing fine timing measurement request (FTMR) frame with reserved bits set in the FTM parameter IE due to improper error handling in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.5 |
| 2021-02-22 | CVE-2020-11278 | Reachable Assertion vulnerability in Qualcomm products Possible denial of service while handling host WMI command due to improper validation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.5 |
| 2021-02-22 | CVE-2020-11271 | Improper Validation of Array Index vulnerability in Qualcomm products Possible out of bounds while accessing global control elements due to race condition in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-02-22 | CVE-2020-11270 | Resource Exhaustion vulnerability in Qualcomm products Possible denial of service due to RTT responder consistently rejects all FTMR by transmitting FTM1 with failure status in the FTM parameter IE in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.5 |
| 2021-02-22 | CVE-2020-11269 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible memory corruption while processing EAPOL frames due to lack of validation of key length before using it in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 8.8 |
| 2021-02-22 | CVE-2020-11204 | Out-of-bounds Write vulnerability in Qualcomm products Possible memory corruption and information leakage in sub-system due to lack of check for validity and boundary compliance for parameters that are read from shared MSG RAM in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-02-22 | CVE-2020-11203 | Out-of-bounds Write vulnerability in Qualcomm products Stack overflow may occur if GSM/WCDMA broadcast config size received from user is larger than variable length array in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.1 |
| 2021-02-22 | CVE-2020-11195 | Out-of-bounds Write vulnerability in Qualcomm products Out of bound write and read in TA while processing command from NS side due to improper length check on command and response buffers in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 7.8 |
| 2021-02-22 | CVE-2020-11187 | Improper Validation of Array Index vulnerability in Qualcomm products Possible memory corruption in BSI module due to improper validation of parameter count in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile | 7.8 |