Vulnerabilities > Qualcomm > Qca8337 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-06-14 | CVE-2021-35130 | Use After Free vulnerability in Qualcomm products Memory corruption in graphics support layer due to use after free condition in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2022-22057 | Race Condition vulnerability in Qualcomm products Use after free in graphics fence due to a race condition while closing fence file descriptor and destroy graphics timeline simultaneously in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2022-22064 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer over read due to lack of size validation while unpacking frame in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |
| 2022-06-14 | CVE-2022-22065 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound read in WLAN HOST due to improper length check can lead to DOS in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |
| 2022-06-14 | CVE-2022-22068 | Use After Free vulnerability in Qualcomm products kernel event may contain unexpected content which is not generated by NPU software in asynchronous execution mode in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2022-22071 | Use After Free vulnerability in Qualcomm products Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 7.8 |
| 2022-04-01 | CVE-2021-1942 | Out-of-bounds Write vulnerability in Qualcomm products Improper handling of permissions of a shared memory region can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 8.8 |
| 2022-04-01 | CVE-2021-30328 | Reachable Assertion vulnerability in Qualcomm products Possible assertion due to improper validation of invalid NR CSI-IM resource configuration in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.5 |
| 2022-04-01 | CVE-2021-30329 | Reachable Assertion vulnerability in Qualcomm products Possible assertion due to improper validation of TCI configuration in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.5 |
| 2022-04-01 | CVE-2021-30331 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to improper data validation of external commands sent via DIAG interface in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 5.5 |