Vulnerabilities > Qualcomm > Qca8075 Firmware > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-02-11 | CVE-2021-30325 | Improper Validation of Array Index vulnerability in Qualcomm products Possible out of bound access of DCI resources due to lack of validation process and resource allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.7 |
| 2022-01-13 | CVE-2021-30313 | Use After Free vulnerability in Qualcomm products Use after free condition can occur in wired connectivity due to a race condition while creating and deleting folders in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.4 |
| 2022-01-03 | CVE-2021-30278 | Improper Input Validation vulnerability in Qualcomm products Improper input validation in TrustZone memory transfer interface can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 5.5 |
| 2021-11-12 | CVE-2021-1924 | Information Exposure Through Discrepancy vulnerability in Qualcomm products Information disclosure through timing and power side-channels during mod exponentiation for RSA-CRT in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 5.5 |
| 2021-09-08 | CVE-2021-1928 | Out-of-bounds Read vulnerability in Qualcomm products Buffer over read could occur due to incorrect check of buffer size while flashing emmc devices in Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.1 |
| 2021-06-09 | CVE-2020-11265 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure issue due to lack of validation of pointer arguments passed to TZ BSP in Snapdragon Wired Infrastructure and Networking | 5.5 |
| 2021-06-09 | CVE-2020-11266 | Unspecified vulnerability in Qualcomm products Image address is dereferenced before validating its range which can cause potential QSEE information leakage in Snapdragon Wired Infrastructure and Networking | 6.5 |
| 2021-04-07 | CVE-2020-11252 | Out-of-bounds Read vulnerability in Qualcomm products Trustzone initialization code will disable xPU`s when memory dumps are enabled and lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 5.5 |
| 2021-02-22 | CVE-2020-3664 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound read access in hypervisor due to an invalid read access attempt by passing invalid addresses in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 6.0 |
| 2021-02-22 | CVE-2020-11198 | Improper Cross-boundary Removal of Sensitive Data vulnerability in Qualcomm products Key material used for TZ diag buffer encryption and other data related to log buffer is not wiped securely due to improper usage of memset in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 6.7 |