Vulnerabilities > Qualcomm > Qca8075 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-01-03 | CVE-2021-30275 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible integer overflow in page alignment interface due to lack of address and size validation before alignment in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2022-01-03 | CVE-2021-30278 | Improper Input Validation vulnerability in Qualcomm products Improper input validation in TrustZone memory transfer interface can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 5.5 |
| 2022-01-03 | CVE-2021-30282 | Improper Validation of Array Index vulnerability in Qualcomm products Possible out of bound write in RAM partition table due to improper validation on number of partitions provided in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2022-01-03 | CVE-2021-30303 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to lack of buffer length check when segmented WMI command is received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2022-01-03 | CVE-2021-30335 | Reachable Assertion vulnerability in Qualcomm products Possible assertion in QOS request due to improper validation when multiple add or update request are received simultaneously in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2022-01-03 | CVE-2021-30337 | Use After Free vulnerability in Qualcomm products Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2022-01-03 | CVE-2021-30351 | Classic Buffer Overflow vulnerability in Qualcomm products An out of bound memory access can occur due to improper validation of number of frames being passed during music playback in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 9.8 |
| 2021-11-12 | CVE-2021-1924 | Information Exposure Through Discrepancy vulnerability in Qualcomm products Information disclosure through timing and power side-channels during mod exponentiation for RSA-CRT in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 5.5 |
| 2021-10-20 | CVE-2021-1980 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer over read due to lack of length check while parsing beacon IE response in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 9.1 |
| 2021-10-20 | CVE-2021-30288 | Out-of-bounds Write vulnerability in Qualcomm products Possible stack overflow due to improper length check of TLV while copying the TLV to a local stack variable in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |