Vulnerabilities > Qualcomm > Qca6574A Firmware > High

DATE CVE VULNERABILITY TITLE RISK
2021-06-09 CVE-2020-11304 Out-of-bounds Read vulnerability in Qualcomm products
Possible out of bound read in DRM due to improper buffer length check.
local
low complexity
qualcomm CWE-125
7.1
2021-06-09 CVE-2021-1900 Use After Free vulnerability in Qualcomm products
Possible use after free in Display due to race condition while creating an external display in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
high complexity
qualcomm CWE-416
7.0
2021-06-09 CVE-2021-1937 Reachable Assertion vulnerability in Qualcomm products
Reachable assertion is possible while processing peer association WLAN message from host and nonstandard incoming packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
network
low complexity
qualcomm CWE-617
7.5
2021-06-09 CVE-2020-11161 Out-of-bounds Read vulnerability in Qualcomm products
Out-of-bounds memory access can occur while calculating alignment requirements for a negative width from external components in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
local
low complexity
qualcomm CWE-125
7.1
2021-06-09 CVE-2020-11165 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption due to buffer overflow while copying the message provided by HLOS into buffer without validating the length of buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-787
7.8
2021-06-09 CVE-2020-11178 Improper Input Validation vulnerability in Qualcomm products
Trusted APPS to overwrite the CPZ memory of another use-case as TZ only checks the physical address not overlapping with its memory and its RoT memory in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-20
7.8
2021-06-09 CVE-2020-11233 Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products
Time-of-check time-of-use race condition While processing partition entries due to newly created buffer was read again from mmc without validation in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
high complexity
qualcomm CWE-367
7.0
2021-06-09 CVE-2020-11235 Integer Overflow or Wraparound vulnerability in Qualcomm products
Buffer overflow might occur while parsing unified command due to lack of check of input data received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-190
7.8
2021-06-09 CVE-2020-11238 Out-of-bounds Read vulnerability in Qualcomm products
Possible Buffer over-read in ARP/NS parsing due to lack of check of packet length received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
network
low complexity
qualcomm CWE-125
7.5
2021-06-09 CVE-2020-11239 Use After Free vulnerability in Qualcomm products
Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned up properly in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-416
7.8