Vulnerabilities > Qualcomm > Qca2064 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-10-19 | CVE-2022-25749 | Out-of-bounds Read vulnerability in Qualcomm products Transient Denial-of-Service in WLAN due to buffer over-read while parsing MDNS frames. | 7.5 |
| 2022-06-14 | CVE-2021-35129 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in BT controller due to improper length check while processing vendor specific commands in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2022-01-03 | CVE-2021-30271 | NULL Pointer Dereference vulnerability in Qualcomm products Possible null pointer dereference in trap handler due to lack of thread ID validation before dereferencing it in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2022-01-03 | CVE-2021-30303 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to lack of buffer length check when segmented WMI command is received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2022-01-03 | CVE-2021-30348 | Resource Exhaustion vulnerability in Qualcomm products Improper validation of LLM utility timers availability can lead to denial of service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 6.5 |
| 2021-11-12 | CVE-2021-1903 | Incorrect Authorization vulnerability in Qualcomm products Possible denial of service scenario can occur due to lack of length check on Channel Switch Announcement IE in beacon or probe response frame in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 5.3 |
| 2021-10-20 | CVE-2021-1980 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer over read due to lack of length check while parsing beacon IE response in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 9.1 |
| 2021-10-20 | CVE-2021-30288 | Out-of-bounds Write vulnerability in Qualcomm products Possible stack overflow due to improper length check of TLV while copying the TLV to a local stack variable in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-10-20 | CVE-2021-30302 | Improper Authentication vulnerability in Qualcomm products Improper authentication of EAP WAPI EAPOL frames from unauthenticated user can lead to information disclosure in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | 7.5 |
| 2021-10-20 | CVE-2021-30304 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer out of bound read can occur due to improper validation of TBTT count and length while parsing the beacon response in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity | 9.1 |