Vulnerabilities > Qualcomm > Msm8937 Firmware > High

DATE CVE VULNERABILITY TITLE RISK
2021-07-13 CVE-2021-1886 Out-of-bounds Write vulnerability in Qualcomm products
Incorrect handling of pointers in trusted application key import mechanism could cause memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-787
7.8
2021-07-13 CVE-2021-1888 Double Free vulnerability in Qualcomm products
Memory corruption in key parsing and import function due to double freeing the same heap allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-415
7.8
2021-07-13 CVE-2021-1889 Classic Buffer Overflow vulnerability in Qualcomm products
Possible buffer overflow due to lack of length check in Trusted Application in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-120
7.8
2021-07-13 CVE-2021-1890 Out-of-bounds Write vulnerability in Qualcomm products
Improper length check of public exponent in RSA import key function could cause memory corruption.
local
low complexity
qualcomm CWE-787
7.8
2021-06-09 CVE-2020-11267 Out-of-bounds Write vulnerability in Qualcomm products
Stack out-of-bounds write occurs while setting up a cipher device if the provided IV length exceeds the max limit value in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-787
7.8
2021-06-09 CVE-2020-11292 Classic Buffer Overflow vulnerability in Qualcomm products
Possible buffer overflow in voice service due to lack of input validation of parameters in QMI Voice API in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-120
7.8
2021-06-09 CVE-2020-11233 Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products
Time-of-check time-of-use race condition While processing partition entries due to newly created buffer was read again from mmc without validation in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
high complexity
qualcomm CWE-367
7.0
2021-06-09 CVE-2020-11239 Use After Free vulnerability in Qualcomm products
Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned up properly in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-416
7.8
2021-06-09 CVE-2020-11261 Improper Input Validation vulnerability in Qualcomm products
Memory corruption due to improper check to return error when user application requests memory allocation of a huge size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-20
7.8
2021-05-07 CVE-2020-11289 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Out of bound write can occur in TZ command handler due to lack of validation of command ID in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-119
7.8