Vulnerabilities > Qualcomm > Mdm9607 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2018-07-06 | CVE-2018-5882 | Out-of-bounds Read vulnerability in Qualcomm products While parsing a Flac file with a corrupted comment block, a buffer over-read can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear. | 9.8 |
| 2018-07-06 | CVE-2018-5878 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products While sending the response to a RIL_REQUEST_GET_SMSC_ADDRESS message, a buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear. | 9.8 |
| 2018-07-06 | CVE-2018-5876 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products While parsing an mp4 file, a buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear. | 8.8 |
| 2018-07-06 | CVE-2018-5875 | Integer Overflow or Wraparound vulnerability in Qualcomm products While parsing an mp4 file, an integer overflow leading to a buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear. | 8.8 |
| 2018-07-06 | CVE-2018-5874 | Out-of-bounds Write vulnerability in Qualcomm products While parsing an mp4 file, a stack-based buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear. | 8.8 |
| 2018-07-06 | CVE-2018-5838 | Improper Validation of Array Index vulnerability in Qualcomm products Improper Validation of Array Index In the adreno OpenGL driver in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, an out-of-bounds access can occur in SurfaceFlinger. | 7.8 |
| 2018-07-06 | CVE-2018-11259 | Incorrect Permission Assignment for Critical Resource vulnerability in Qualcomm products Due to Improper Access Control of NAND-based EFS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, From fastboot on a NAND-based device, the EFS partition can be erased. | 7.7 |
| 2018-07-06 | CVE-2018-11258 | Use After Free vulnerability in Qualcomm products In ADSP RPC in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, a Use After Free condition can occur in versions MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20. | 7.8 |
| 2018-04-18 | CVE-2016-10501 | Improper Input Validation vulnerability in Qualcomm products In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile, Snapdragon Wear, and Small Cell SoC FSM9055, MDM9206, MDM9607, MDM9635M, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, and SD 835, improper input validation can occur while parsing an image. | 9.8 |
| 2018-04-18 | CVE-2016-10499 | Resource Management Errors vulnerability in Qualcomm products In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, and SDX20, memory leak may occur in the IPSecurity module when repeating IKE-Rekey. | 7.5 |