Vulnerabilities > Qualcomm > Mdm9206 Firmware > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-07-13 | CVE-2021-1955 | Reachable Assertion vulnerability in Qualcomm products Denial of service in SAP case due to improper handling of connections when association is rejected in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 5.0 |
| 2021-06-09 | CVE-2020-11267 | Out-of-bounds Write vulnerability in Qualcomm products Stack out-of-bounds write occurs while setting up a cipher device if the provided IV length exceeds the max limit value in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 4.6 |
| 2021-06-09 | CVE-2020-11298 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products While waiting for a response to a callback or listener request, non-secure clients can change permissions to shared memory buffers used by HLOS Invoke Call to secure kernel in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 6.9 |
| 2021-06-09 | CVE-2021-1900 | Use After Free vulnerability in Qualcomm products Possible use after free in Display due to race condition while creating an external display in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 4.4 |
| 2021-06-09 | CVE-2020-11233 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Time-of-check time-of-use race condition While processing partition entries due to newly created buffer was read again from mmc without validation in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.9 |
| 2021-06-09 | CVE-2020-11262 | Use After Free vulnerability in Qualcomm products A race between command submission and destroying the context can cause an invalid context being added to the list leads to use after free issue. | 4.4 |
| 2021-03-17 | CVE-2020-11305 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Integer overflow in boot due to improper length check on arguments received in Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music | 4.6 |
| 2021-03-17 | CVE-2020-11226 | Improper Validation of Array Index vulnerability in Qualcomm products Out of bound memory read in Data modem while unpacking data due to lack of offset length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 5.0 |
| 2021-03-17 | CVE-2020-11190 | Out-of-bounds Read vulnerability in Qualcomm products Buffer over-read can happen while parsing received SDP values due to lack of NULL termination check on SDP in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.4 |
| 2021-03-17 | CVE-2020-11189 | Out-of-bounds Read vulnerability in Qualcomm products Buffer over-read can happen while parsing received SDP values due to lack of NULL termination check on SDP in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.4 |