Vulnerabilities > Qualcomm > Mdm9206 Firmware > High

DATE CVE VULNERABILITY TITLE RISK
2018-10-23 CVE-2017-18293 Unspecified vulnerability in Qualcomm products
When a particular GPIO is protected by blocking access to the corresponding GPIO resource registers, the protection can be bypassed using the corresponding banked GPIO registers instead in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 835, SDA660.
local
low complexity
qualcomm
7.2
2018-10-23 CVE-2017-18282 Unspecified vulnerability in Qualcomm products
Non-secure SW can cause SDCC to generate secure bus accesses, which may expose RPM access in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 835, SDA660.
local
low complexity
qualcomm
7.2
2018-09-20 CVE-2018-11982 Double Free vulnerability in Qualcomm products
In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure.
low complexity
qualcomm CWE-415
8.3
2018-09-20 CVE-2018-11292 Integer Overflow or Wraparound vulnerability in Qualcomm products
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, lack of input validation in WLANWMI command handlers can lead to integer & heap overflows.
local
low complexity
qualcomm CWE-190
7.2
2018-09-20 CVE-2018-11269 Improper Validation of Array Index vulnerability in Qualcomm products
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options.
local
low complexity
qualcomm CWE-129
7.2
2018-09-20 CVE-2018-11268 Improper Validation of Array Index vulnerability in Qualcomm products
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options.
local
low complexity
qualcomm CWE-129
7.2
2018-09-20 CVE-2018-11267 Improper Validation of Array Index vulnerability in Qualcomm products
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20.
local
low complexity
qualcomm CWE-129
7.2
2018-07-06 CVE-2018-5882 Out-of-bounds Read vulnerability in Qualcomm products
While parsing a Flac file with a corrupted comment block, a buffer over-read can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear.
network
low complexity
qualcomm CWE-125
7.5
2018-07-06 CVE-2018-5878 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
While sending the response to a RIL_REQUEST_GET_SMSC_ADDRESS message, a buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear.
network
low complexity
qualcomm CWE-119
7.5
2018-04-18 CVE-2016-10499 Resource Management Errors vulnerability in Qualcomm products
In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, and SDX20, memory leak may occur in the IPSecurity module when repeating IKE-Rekey.
network
low complexity
qualcomm CWE-399
7.8