Vulnerabilities > Qualcomm > Apq8009 Firmware > High

DATE CVE VULNERABILITY TITLE RISK
2021-11-12 CVE-2021-30254 Improper Input Validation vulnerability in Qualcomm products
Possible buffer overflow due to improper input validation in factory calibration and test DIAG command in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-20
7.2
2021-11-12 CVE-2021-30255 Improper Validation of Array Index vulnerability in Qualcomm products
Possible buffer overflow due to improper input validation in PDM DIAG command in FTM in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-129
7.2
2021-10-20 CVE-2021-1949 Integer Overflow or Wraparound vulnerability in Qualcomm products
Possible integer overflow due to improper check of batch count value while sanitizer is enabled in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-190
7.2
2021-10-20 CVE-2021-1959 Out-of-bounds Write vulnerability in Qualcomm products
Possible memory corruption due to lack of bound check of input index in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-787
7.2
2021-10-20 CVE-2021-30288 Out-of-bounds Write vulnerability in Qualcomm products
Possible stack overflow due to improper length check of TLV while copying the TLV to a local stack variable in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-787
7.2
2021-09-17 CVE-2021-30261 Improper Input Validation vulnerability in Qualcomm products
Possible integer and heap overflow due to lack of input command size validation while handling beacon template update command from HLOS in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-20
7.2
2021-09-09 CVE-2021-1909 Classic Buffer Overflow vulnerability in Qualcomm products
Buffer overflow occurs in trusted applications due to lack of length check of parameters in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-120
7.2
2021-06-09 CVE-2020-11292 Classic Buffer Overflow vulnerability in Qualcomm products
Possible buffer overflow in voice service due to lack of input validation of parameters in QMI Voice API in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-120
7.2
2021-06-09 CVE-2020-11235 Integer Overflow or Wraparound vulnerability in Qualcomm products
Buffer overflow might occur while parsing unified command due to lack of check of input data received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-190
7.2
2021-06-09 CVE-2020-11239 Use After Free vulnerability in Qualcomm products
Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned up properly in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-416
7.2