Vulnerabilities > CVE-2019-2297 - Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products
Attack vector
LOCAL Attack complexity
LOW Privileges required
NONE Confidentiality impact
PARTIAL Integrity impact
PARTIAL Availability impact
PARTIAL Summary
Buffer overflow can occur while processing non-standard NAN message from user space. in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8064, APQ8096AU, IPQ4019, IPQ8064, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8996AU, QCA6174A, QCA6574AU, QCA9377, QCA9379, QCN7605, QCS405, QCS605, SDA660, SDA845, SDM636, SDM660, SDM845, SDX20, SDX24, SM8150