Vulnerabilities > CVE-2017-18157 - Use After Free vulnerability in Qualcomm products
Attack vector
LOCAL Attack complexity
LOW Privileges required
LOW Confidentiality impact
HIGH Integrity impact
HIGH Availability impact
HIGH Summary
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.