Vulnerabilities
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2025-03-03 | CVE-2024-43061 | Use After Free vulnerability in Qualcomm products Memory corruption during voice activation, when sound model parameters are loaded from HLOS, and the received sound model list is empty in HLOS drive. | 7.8 |
2025-03-03 | CVE-2024-43062 | Use After Free vulnerability in Qualcomm products Memory corruption caused by missing locks and checks on the DMA fence and improper synchronization. | 7.8 |
2025-03-03 | CVE-2024-45580 | Use After Free vulnerability in Qualcomm products Memory corruption while handling multuple IOCTL calls from userspace for remote invocation. | 7.8 |
2025-03-03 | CVE-2024-49836 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption may occur during the synchronization of the camera`s frame processing pipeline. | 7.8 |
2025-03-03 | CVE-2024-53012 | Improper Input Validation vulnerability in Qualcomm products Memory corruption may occur due to improper input validation in clock device. | 7.8 |
2025-03-03 | CVE-2024-53014 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption may occur while validating ports and channels in Audio driver. | 7.8 |
2025-03-03 | CVE-2024-53022 | Improper Input Validation vulnerability in Qualcomm products Memory corruption may occur during communication between primary and guest VM. | 7.8 |
2025-03-03 | CVE-2024-53023 | Use After Free vulnerability in Qualcomm products Memory corruption may occur while accessing a variable during extended back to back tests. | 7.8 |
2025-03-03 | CVE-2024-53024 | NULL Pointer Dereference vulnerability in Qualcomm products Memory corruption in display driver while detaching a device. | 7.8 |
2025-03-03 | CVE-2024-53025 | Integer Overflow or Wraparound vulnerability in Qualcomm products Transient DOS can occur while processing UCI command. | 5.5 |