Security News > 2021 > February > Samsung HBM-PIM brings AI computing capabilities inside high-performance memory

Samsung announced that it has developed the industry's first High Bandwidth Memory integrated with artificial intelligence processing power - the HBM-PIM. The new processing-in-memory architecture brings powerful AI computing capabilities inside high-performance memory, to accelerate large-scale processing in data centers, high performance computing systems and AI-enabled mobile applications.

Kwangil Park, senior vice president of Memory Product Planning at Samsung Electronics stated, "Our groundbreaking HBM-PIM is the industry's first programmable PIM solution tailored for diverse AI-driven workloads such as HPC, training and inference. We plan to build upon this breakthrough by further collaborating with AI solution providers for even more advanced PIM-powered applications."

"Rick Stevens, Argonne's Associate Laboratory Director for Computing, Environment and Life Sciences commented,"I'm delighted to see that Samsung is addressing the memory bandwidth/power challenges for HPC and AI computing.

"HBM-PIM design has demonstrated impressive performance and power gains on important classes of AI applications, so we look forward to working together to evaluate its performance on additional problems of interest to Argonne National Laboratory."

Instead, the HBM-PIM brings processing power directly to where the data is stored by placing a DRAM-optimized AI engine inside each memory bank - a storage sub-unit - enabling parallel processing and minimizing data movement.

Samsung's HBM-PIM is now being tested inside AI accelerators by leading AI solution partners, with all validations expected to be completed within the first half of this year.

News URL

http://feedproxy.google.com/~r/HelpNetSecurity/~3/dYDd2_zYFsU/