Security News > 2020 > April > BOE and Qualcomm develop display products featuring Qualcomm 3D Sonic fingerprint sensors

BOE Technology Group and Qualcomm Technologies announce their plans to establish a strategic collaboration to develop innovative display products featuring Qualcomm 3D Sonic ultrasonic fingerprint sensors.

This collaboration is expected to extend from mobile and associated 5G technologies to XR and IoT. BOE's expertise in interface devices and smart IoT systems combined with Qualcomm Technologies' broad product portfolio, makes this an ideal collaboration for the 5G era, in which consumers can expect extraordinary performance improvements resulting from the tight integration of both Companies' multiple key technologies, including sensors, antennae, display picture processing, etc.

Anticipating the signing of a collaboration agreement, both companies have started working on incorporating value-added and distinctive features to BOE's flexible OLED panels, including the Qualcomm 3D Sonic sensor.

Integrating Qualcomm 3D Sonic sensors onto BOE's flexible OLED displays is intended to bring a more streamlined solution, which can enable smartphone OEMs to create unique products using the industry's thinnest and highest security fingerprint solution.

Based on the collaboration, BOE will offer integrated displays with Qualcomm 3D Sonic fingerprint sensors to its customers.

News URL

http://feedproxy.google.com/~r/HelpNetSecurity/~3/6Z4Fi5oTVcA/