Vulnerabilities > TI > Simplelink Cc2640R2 Software Development KIT

DATE CVE VULNERABILITY TITLE RISK
2020-08-31 CVE-2020-13593 Improper Verification of Cryptographic Signature vulnerability in TI Simplelink-Cc2640R2 Software Development KIT 2.2.3
The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation in Texas Instruments SimpleLink SIMPLELINK-CC2640R2-SDK through 2.2.3 allows the Diffie-Hellman check during the Secure Connection pairing to be skipped if the Link Layer encryption setup is performed earlier.
low complexity
ti CWE-347
8.8