Vulnerabilities > TI > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2020-10-27 | CVE-2020-27891 | Unspecified vulnerability in TI Z-Stack 3.0.1 The Zigbee protocol implementation on Texas Instruments CC2538 devices with Z-Stack 3.0.1 does not properly process a ZCL Read Reporting Configuration Response message. | 7.5 |
2020-10-27 | CVE-2020-27890 | Unspecified vulnerability in TI Z-Stack 3.0.1 The Zigbee protocol implementation on Texas Instruments CC2538 devices with Z-Stack 3.0.1 does not properly process a ZCL Write Attributes No Response message. | 8.2 |
2020-08-31 | CVE-2020-13593 | Improper Verification of Cryptographic Signature vulnerability in TI Simplelink-Cc2640R2 Software Development KIT 2.2.3 The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation in Texas Instruments SimpleLink SIMPLELINK-CC2640R2-SDK through 2.2.3 allows the Diffie-Hellman check during the Secure Connection pairing to be skipped if the Link Layer encryption setup is performed earlier. | 8.8 |
2019-11-13 | CVE-2019-15948 | Classic Buffer Overflow vulnerability in TI products Texas Instruments CC256x and WL18xx dual-mode Bluetooth controller devices, when LE scan mode is used, allow remote attackers to trigger a buffer overflow via a malformed Bluetooth Low Energy advertising packet, to cause a denial of service or potentially execute arbitrary code. | 8.8 |
2018-11-06 | CVE-2018-16986 | Out-of-bounds Write vulnerability in TI Ble-Stack Texas Instruments BLE-STACK v2.2.1 for SimpleLink CC2640 and CC2650 devices allows remote attackers to execute arbitrary code via a malformed packet that triggers a buffer overflow. | 8.8 |