Vulnerabilities > TI
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2020-10-27 | CVE-2020-27890 | Improper Input Validation vulnerability in TI Z-Stack 3.0.1 The Zigbee protocol implementation on Texas Instruments CC2538 devices with Z-Stack 3.0.1 does not properly process a ZCL Write Attributes No Response message. | 6.4 |
| 2020-08-31 | CVE-2020-13593 | Incorrect Authorization vulnerability in TI Simplelink-Cc2640R2 Software Development KIT 2.2.3 The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation in Texas Instruments SimpleLink SIMPLELINK-CC2640R2-SDK through 2.2.3 allows the Diffie-Hellman check during the Secure Connection pairing to be skipped if the Link Layer encryption setup is performed earlier. | 5.8 |
| 2020-02-10 | CVE-2019-19193 | Unspecified vulnerability in TI Ble-Stack and Cc2640R2 Software Development KIT The Bluetooth Low Energy peripheral implementation on Texas Instruments SIMPLELINK-CC2640R2-SDK through 3.30.00.20 and BLE-STACK through 1.5.0 before Q4 2019 for CC2640R2 and CC2540/1 devices does not properly restrict the advertisement connection request packet on reception, allowing attackers in radio range to cause a denial of service (crash) via a crafted packet. low complexity ti | 6.1 |
| 2020-02-10 | CVE-2019-17520 | Classic Buffer Overflow vulnerability in TI Cc2640R2 Software Development KIT The Bluetooth Low Energy implementation on Texas Instruments SDK through 3.30.00.20 for CC2640R2 devices does not properly restrict the SM Public Key packet on reception, allowing attackers in radio range to cause a denial of service (crash) via crafted packets. | 6.1 |
| 2019-11-13 | CVE-2019-15948 | Classic Buffer Overflow vulnerability in TI products Texas Instruments CC256x and WL18xx dual-mode Bluetooth controller devices, when LE scan mode is used, allow remote attackers to trigger a buffer overflow via a malformed Bluetooth Low Energy advertising packet, to cause a denial of service or potentially execute arbitrary code. | 5.8 |
| 2019-08-20 | CVE-2018-18056 | Information Exposure vulnerability in TI Tm4C123 Firmware and Tm4C129 Firmware An issue was discovered in the Texas Instruments (TI) TM4C, MSP432E and MSP432P microcontroller series. | 2.1 |
| 2018-11-06 | CVE-2018-16986 | Out-of-bounds Write vulnerability in TI Ble-Stack 3.0.0 Texas Instruments BLE-STACK v2.2.1 for SimpleLink CC2640 and CC2650 devices allows remote attackers to execute arbitrary code via a malformed packet that triggers a buffer overflow. | 5.8 |