Vulnerabilities > Qualcomm > Wsa8830 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-08-05 | CVE-2024-33020 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while processing TID-to-link mapping IE elements. | 7.5 |
| 2024-08-05 | CVE-2024-33021 | Use of Uninitialized Resource vulnerability in Qualcomm products Memory corruption while processing IOCTL call to set metainfo. | 7.8 |
| 2024-08-05 | CVE-2024-33022 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption while allocating memory in HGSL driver. | 7.8 |
| 2024-08-05 | CVE-2024-33023 | Use After Free vulnerability in Qualcomm products Memory corruption while creating a fence to wait on timeline events, and simultaneously signal timeline events. | 7.8 |
| 2024-08-05 | CVE-2024-33024 | Integer Overflow or Wraparound vulnerability in Qualcomm products Transient DOS while parsing the ML IE when a beacon with length field inside the common info of ML IE greater than the ML IE length. | 7.5 |
| 2024-08-05 | CVE-2024-33025 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing the BSS parameter change count or MLD capabilities fields of the ML IE. | 7.5 |
| 2024-08-05 | CVE-2024-33028 | Use After Free vulnerability in Qualcomm products Memory corruption as fence object may still be accessed in timeline destruct after isync fence is released. | 7.8 |
| 2024-08-05 | CVE-2024-33034 | Use After Free vulnerability in Qualcomm products Memory corruption can occur if VBOs hold outdated or invalid GPU SMMU mappings, especially when the binding and reclaiming of memory buffers are performed at the same time. | 7.8 |
| 2024-07-01 | CVE-2023-43554 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while processing IOCTL handler in FastRPC. | 7.8 |
| 2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |