Vulnerabilities > Qualcomm > Wsa8830 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-04-01 | CVE-2021-35117 | Out-of-bounds Read vulnerability in Qualcomm products An Out of Bounds read may potentially occur while processing an IBSS beacon, in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 9.4 |
| 2022-02-11 | CVE-2021-30309 | Classic Buffer Overflow vulnerability in Qualcomm products Improper size validation of QXDM commands can lead to memory corruption in Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 4.6 |
| 2022-02-11 | CVE-2021-30317 | Improper Authentication vulnerability in Qualcomm products Improper validation of program headers containing ELF metadata can lead to image verification bypass in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.2 |
| 2022-02-11 | CVE-2021-30318 | Classic Buffer Overflow vulnerability in Qualcomm products Improper validation of input when provisioning the HDCP key can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables | 4.6 |
| 2022-02-11 | CVE-2021-30322 | Out-of-bounds Write vulnerability in Qualcomm products Possible out of bounds write due to improper validation of number of GPIOs configured in an internal parameters array in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.2 |
| 2022-02-11 | CVE-2021-30324 | Classic Buffer Overflow vulnerability in Qualcomm products Possible out of bound write due to lack of boundary check for the maximum size of buffer when sending a DCI packet to remote process in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 4.6 |
| 2022-02-11 | CVE-2021-30326 | Reachable Assertion vulnerability in Qualcomm products Possible assertion due to improper size validation while processing the DownlinkPreemption IE in an RRC Reconfiguration/RRC Setup message in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 5.0 |
| 2022-02-11 | CVE-2021-35068 | NULL Pointer Dereference vulnerability in Qualcomm products Lack of null check while freeing the device information buffer in the Bluetooth HFP protocol can lead to a NULL pointer dereference in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |
| 2022-02-11 | CVE-2021-35069 | Integer Overflow or Wraparound vulnerability in Qualcomm products Improper validation of data length received from DMA buffer can lead to memory corruption. | 7.2 |
| 2022-02-11 | CVE-2021-35074 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible integer overflow due to improper fragment datatype while calculating number of fragments in a request message in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.2 |