Vulnerabilities > Qualcomm > Wsa8830 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2024-10-07 | CVE-2024-23369 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption when invalid length is provided from HLOS for FRS/UDS request/response buffers. | 7.8 |
2024-10-07 | CVE-2024-23370 | Use After Free vulnerability in Qualcomm products Memory corruption when a process invokes IOCTL calls from user-space to create a HAB virtual channel and another process invokes IOCTL calls to destroy the same. | 6.7 |
2024-10-07 | CVE-2024-23374 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption is possible when an attempt is made from userspace or console to write some haptics effects pattern to the haptics debugfs file. | 6.7 |
2024-10-07 | CVE-2024-23375 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption during the network scan request. | 6.7 |
2024-10-07 | CVE-2024-23376 | Use After Free vulnerability in Qualcomm products Memory corruption while sending the persist buffer command packet from the user-space to the kernel space through the IOCTL call. | 6.7 |
2024-10-07 | CVE-2024-23379 | Double Free vulnerability in Qualcomm products Memory corruption while unmapping the fastrpc map when two threads can free the same map in concurrent scenario. | 6.7 |
2024-10-07 | CVE-2024-33049 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing noninheritance IE of Extension element when length of IE is 2 of beacon frame. | 7.5 |
2024-10-07 | CVE-2024-33065 | Unspecified vulnerability in Qualcomm products Memory corruption while taking snapshot when an offset variable is set by camera driver. | 7.8 |
2024-10-07 | CVE-2024-33069 | Use After Free vulnerability in Qualcomm products Transient DOS when transmission of management frame sent by host is not successful and error status is received in the host. | 7.5 |
2024-10-07 | CVE-2024-33073 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while parsing the BSS parameter change count or MLD capabilities fields of the ML IE. | 8.2 |