Vulnerabilities > Qualcomm > Wcn685X 5 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-04-13 | CVE-2022-33231 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in core while initializing the encryption key. | 7.8 |
2023-04-13 | CVE-2022-33269 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption due to integer overflow or wraparound in Core while DDR memory assignment. | 7.8 |
2023-04-13 | CVE-2022-33270 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Transient DOS due to time-of-check time-of-use race condition in Modem while processing RRC Reconfiguration message. | 5.9 |
2023-04-13 | CVE-2022-33287 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure in Modem due to buffer over-read while getting length of Unfragmented headers in an IPv6 packet. | 7.5 |
2023-04-13 | CVE-2022-33288 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to buffer copy without checking the size of input in Core while sending SCM command to get write protection information. | 8.8 |
2023-04-13 | CVE-2022-33289 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card. | 6.8 |
2023-04-13 | CVE-2022-33291 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure in Modem due to buffer over-read while receiving a IP header with malformed length. | 7.5 |
2023-04-13 | CVE-2022-33296 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption due to integer overflow to buffer overflow in Modem while parsing Traffic Channel Neighbor List Update message. | 7.8 |
2023-04-13 | CVE-2022-33298 | Use After Free vulnerability in Qualcomm products Memory corruption due to use after free in Modem while modem initialization. | 7.8 |
2023-04-13 | CVE-2022-33302 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length. | 7.8 |