Vulnerabilities > Qualcomm > Wcn685X 5 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-12-05 | CVE-2023-33063 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Services during a remote call from HLOS to DSP. | 7.8 |
2023-12-05 | CVE-2023-33079 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption in Audio while running invalid audio recording from ADSP. | 7.8 |
2023-12-05 | CVE-2023-33080 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. | 7.5 |
2023-12-05 | CVE-2023-33081 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while converting TWT (Target Wake Time) frame parameters in the OTA broadcast. | 7.5 |
2023-12-05 | CVE-2023-33082 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while sending an Assoc Request having BTM Query or BTM Response containing MBO IE. | 9.8 |
2023-12-05 | CVE-2023-33083 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in WLAN Host while processing RRM beacon on the AP. | 9.8 |
2023-12-05 | CVE-2023-33087 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Core while processing RX intent request. | 7.8 |
2023-11-07 | CVE-2023-28574 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in core services when Diag handler receives a command to configure event listeners. | 7.8 |
2023-11-07 | CVE-2023-33031 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer. | 7.8 |
2023-11-07 | CVE-2023-33045 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN Firmware while parsing a NAN management frame carrying a S3 attribute. | 9.8 |