Vulnerabilities > Qualcomm > Wcn685X 1 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-12-05 | CVE-2023-33079 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption in Audio while running invalid audio recording from ADSP. | 7.8 |
| 2023-12-05 | CVE-2023-33080 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. | 7.5 |
| 2023-12-05 | CVE-2023-33081 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while converting TWT (Target Wake Time) frame parameters in the OTA broadcast. | 7.5 |
| 2023-12-05 | CVE-2023-33087 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Core while processing RX intent request. | 7.8 |
| 2023-11-07 | CVE-2023-28574 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in core services when Diag handler receives a command to configure event listeners. | 7.8 |
| 2023-11-07 | CVE-2023-33031 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer. | 7.8 |
| 2023-11-07 | CVE-2023-33047 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing no-inherit IES. | 7.5 |
| 2023-11-07 | CVE-2023-33048 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing t2lm buffers. | 7.5 |
| 2023-11-07 | CVE-2023-33055 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Audio while invoking callback function in driver from ADSP. | 7.8 |
| 2023-11-07 | CVE-2023-33056 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS in WLAN Firmware when firmware receives beacon including T2LM IE. | 7.5 |