Vulnerabilities > Qualcomm > Wcn6856 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-10-19 | CVE-2022-25687 | Classic Buffer Overflow vulnerability in Qualcomm products memory corruption in video due to buffer overflow while parsing asf clips in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |
| 2022-10-19 | CVE-2022-25720 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption in WLAN due to out of bound array access during connect/roaming in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |
| 2022-10-19 | CVE-2022-25723 | Use After Free vulnerability in Qualcomm products Memory corruption in multimedia due to use after free during callback registration failure in Snapdragon Mobile | 7.8 |
| 2022-10-19 | CVE-2022-25736 | Out-of-bounds Read vulnerability in Qualcomm products Denial of service in WLAN due to out-of-bound read happens while processing VHT action frame in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.5 |
| 2022-10-19 | CVE-2022-25748 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in WLAN due to integer overflow to buffer overflow while parsing GTK frames. | 9.8 |
| 2022-10-19 | CVE-2022-25749 | Out-of-bounds Read vulnerability in Qualcomm products Transient Denial-of-Service in WLAN due to buffer over-read while parsing MDNS frames. | 7.5 |
| 2022-10-19 | CVE-2022-25750 | Double Free vulnerability in Qualcomm products Memory corruption in BTHOST due to double free while music playback and calls over bluetooth headset in Snapdragon Mobile | 8.8 |
| 2022-10-19 | CVE-2022-33214 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption in display due to time-of-check time-of-use of metadata reserved size in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.0 |
| 2022-10-19 | CVE-2022-33217 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Qualcomm IPC due to buffer copy without checking the size of input while starting communication with a compromised kernel. | 7.8 |
| 2022-09-16 | CVE-2022-22066 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption occurs while processing command received from HLOS due to improper length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |