Vulnerabilities > Qualcomm > Wcn6851 Firmware > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-09-08 | CVE-2021-1904 | Incorrect Comparison vulnerability in Qualcomm products Child process can leak information from parent process due to numeric pids are getting compared and these pid can be reused in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 5.5 |
| 2021-09-08 | CVE-2021-1929 | Unspecified vulnerability in Qualcomm products Lack of strict validation of bootmode can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 5.5 |
| 2021-07-13 | CVE-2021-1931 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to improper validation of buffer length while processing fast boot commands in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 6.7 |
| 2021-06-09 | CVE-2020-11160 | Integer Overflow or Wraparound vulnerability in Qualcomm products Resource leakage issue during dci client registration due to reference count is not decremented if dci client registration fails in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.7 |
| 2021-05-07 | CVE-2021-1906 | Improper Handling of Exceptional Conditions vulnerability in Qualcomm products Improper handling of address deregistration on failure can lead to new GPU address allocation failure. | 5.5 |
| 2021-04-07 | CVE-2020-11252 | Out-of-bounds Read vulnerability in Qualcomm products Trustzone initialization code will disable xPU`s when memory dumps are enabled and lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 5.5 |
| 2021-04-07 | CVE-2020-11236 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to invalid value of total dimension in the non-histogram type KPI could lead to a denial of service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile | 5.5 |
| 2021-04-07 | CVE-2020-11231 | Double Free vulnerability in Qualcomm products Two threads call one or both functions concurrently leading to corruption of pointers and reference counters which in turn can lead to heap corruption in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 6.7 |
| 2021-03-17 | CVE-2020-11308 | Improper Validation of Array Index vulnerability in Qualcomm products Buffer overflow occurs when trying to convert ASCII string to Unicode string if the actual size is more than required in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 6.8 |
| 2021-03-17 | CVE-2020-11230 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Potential arbitrary memory corruption when the qseecom driver updates ion physical addresses in the buffer as it exposes a physical address to user land in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 6.4 |