Vulnerabilities > Qualcomm > Wcn6750 Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-12-05 | CVE-2023-33087 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Core while processing RX intent request. | 7.8 |
2023-11-07 | CVE-2023-28574 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in core services when Diag handler receives a command to configure event listeners. | 7.8 |
2023-11-07 | CVE-2023-33031 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer. | 7.8 |
2023-11-07 | CVE-2023-33047 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing no-inherit IES. | 7.5 |
2023-11-07 | CVE-2023-33055 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Audio while invoking callback function in driver from ADSP. | 7.8 |
2023-11-07 | CVE-2023-33059 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio while processing the VOC packet data from ADSP. | 7.8 |
2023-11-07 | CVE-2023-33074 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio when SSR event is triggered after music playback is stopped. | 7.8 |
2023-10-03 | CVE-2023-28540 | Improper Authentication vulnerability in Qualcomm products Cryptographic issue in Data Modem due to improper authentication during TLS handshake. | 7.5 |
2023-10-03 | CVE-2023-33026 | Resource Exhaustion vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing a NAN management frame. | 7.5 |
2023-10-03 | CVE-2023-33027 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing rsn ies. | 7.5 |