Vulnerabilities > Qualcomm > Wcn3990 Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-06-06 | CVE-2022-33227 | Double Free vulnerability in Qualcomm products Memory corruption in Linux android due to double free while calling unregister provider after register call. | 7.8 |
2023-06-06 | CVE-2022-33264 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message. | 7.8 |
2023-06-06 | CVE-2022-33307 | Double Free vulnerability in Qualcomm products Memory Corruption due to double free in automotive when a bad HLOS address for one of the lists to be mapped is passed. | 7.8 |
2023-06-06 | CVE-2022-40507 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in Core while mapping HLOS address to the list. | 7.8 |
2023-06-06 | CVE-2022-40521 | Improper Authentication vulnerability in Qualcomm products Transient DOS due to improper authorization in Modem | 7.5 |
2023-06-06 | CVE-2022-40529 | Incorrect Authorization vulnerability in Qualcomm products Memory corruption due to improper access control in kernel while processing a mapping request from root process. | 7.8 |
2023-06-06 | CVE-2023-21628 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing WMI-UTF command or FTM TLV1 command. | 7.8 |
2023-06-06 | CVE-2023-21656 | Improper Input Validation vulnerability in Qualcomm products Memory corruption in WLAN HOST while receiving an WMI event from firmware. | 7.8 |
2023-06-06 | CVE-2023-21657 | Improper Input Validation vulnerability in Qualcomm products Memoru corruption in Audio when ADSP sends input during record use case. | 7.8 |
2023-06-06 | CVE-2023-21659 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while processing frames with missing header fields. | 7.5 |