Vulnerabilities > Qualcomm > Wcn3950 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-06-09 | CVE-2020-11134 | Improper Validation of Array Index vulnerability in Qualcomm products Possible stack out of bound write might happen due to time bitmap length and bit duration fields of the attributes like NAN ranging setup attribute inside a NAN management frame are not Properly validated in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 9.8 |
| 2021-06-09 | CVE-2020-11159 | Out-of-bounds Read vulnerability in Qualcomm products Buffer over-read can happen while processing WPA,RSN IE of beacon and response frames if IE length is less than length of frame pointer being accessed in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 9.1 |
| 2021-06-09 | CVE-2020-11160 | Integer Overflow or Wraparound vulnerability in Qualcomm products Resource leakage issue during dci client registration due to reference count is not decremented if dci client registration fails in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.7 |
| 2021-06-09 | CVE-2020-11161 | Out-of-bounds Read vulnerability in Qualcomm products Out-of-bounds memory access can occur while calculating alignment requirements for a negative width from external components in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 7.1 |
| 2021-06-09 | CVE-2020-11165 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to buffer overflow while copying the message provided by HLOS into buffer without validating the length of buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-06-09 | CVE-2020-11178 | Improper Input Validation vulnerability in Qualcomm products Trusted APPS to overwrite the CPZ memory of another use-case as TZ only checks the physical address not overlapping with its memory and its RoT memory in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-06-09 | CVE-2020-11182 | Out-of-bounds Write vulnerability in Qualcomm products Possible heap overflow while parsing NAL header due to lack of check of length of data received from user in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 9.8 |
| 2021-06-09 | CVE-2020-11235 | Integer Overflow or Wraparound vulnerability in Qualcomm products Buffer overflow might occur while parsing unified command due to lack of check of input data received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-06-09 | CVE-2020-11238 | Out-of-bounds Read vulnerability in Qualcomm products Possible Buffer over-read in ARP/NS parsing due to lack of check of packet length received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.5 |
| 2021-06-09 | CVE-2020-11239 | Use After Free vulnerability in Qualcomm products Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned up properly in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |