Vulnerabilities > Qualcomm > Wcn3680B Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2024-01-02 | CVE-2023-33085 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in wearables while processing data from AON. | 7.8 |
2024-01-02 | CVE-2023-33094 | Use After Free vulnerability in Qualcomm products Memory corruption while running VK synchronization with KASAN enabled. | 7.8 |
2024-01-02 | CVE-2023-33110 | Race Condition vulnerability in Qualcomm products The session index variable in PCM host voice audio driver initialized before PCM open, accessed during event callback from ADSP and reset during PCM close may lead to race condition between event callback - PCM close and reset session index causing memory corruption. | 7.0 |
2024-01-02 | CVE-2023-33114 | Use After Free vulnerability in Qualcomm products Memory corruption while running NPU, when NETWORK_UNLOAD and (NETWORK_UNLOAD or NETWORK_EXECUTE_V2) commands are submitted at the same time. | 7.8 |
2024-01-02 | CVE-2023-33117 | Use After Free vulnerability in Qualcomm products Memory corruption when HLOS allocates the response payload buffer to copy the data received from ADSP in response to AVCS_LOAD_MODULE command. | 7.8 |
2024-01-02 | CVE-2023-33118 | Use After Free vulnerability in Qualcomm products Memory corruption while processing Listen Sound Model client payload buffer when there is a request for Listen Sound session get parameter from ST HAL. | 7.8 |
2024-01-02 | CVE-2023-33120 | Use After Free vulnerability in Qualcomm products Memory corruption in Audio when memory map command is executed consecutively in ADSP. | 7.8 |
2023-12-05 | CVE-2023-21634 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Radio Interface Layer while sending an SMS or writing an SMS to SIM. | 7.8 |
2023-12-05 | CVE-2023-22383 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in camera while installing a fd for a particular DMA buffer. | 7.8 |
2023-12-05 | CVE-2023-28546 | Classic Buffer Overflow vulnerability in Qualcomm products Memory Corruption in SPS Application while exporting public key in sorter TA. | 7.8 |