Vulnerabilities > Qualcomm > Wcn3660B Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-11-07 | CVE-2023-33055 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Audio while invoking callback function in driver from ADSP. | 7.8 |
2023-11-07 | CVE-2023-33059 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio while processing the VOC packet data from ADSP. | 7.8 |
2023-10-03 | CVE-2023-24848 | Unspecified vulnerability in Qualcomm products Information Disclosure in Data Modem while performing a VoLTE call with an undefined RTCP FB line value. | 7.5 |
2023-10-03 | CVE-2023-24849 | Unspecified vulnerability in Qualcomm products Information Disclosure in data Modem while parsing an FMTP line in an SDP message. | 7.5 |
2023-10-03 | CVE-2023-24850 | Improper Validation of Array Index vulnerability in Qualcomm products Memory Corruption in HLOS while importing a cryptographic key into KeyMaster Trusted Application. | 7.8 |
2023-10-03 | CVE-2023-28540 | Improper Authentication vulnerability in Qualcomm products Cryptographic issue in Data Modem due to improper authentication during TLS handshake. | 7.5 |
2023-10-03 | CVE-2023-33035 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while invoking callback function of AFE from ADSP. | 7.8 |
2023-09-05 | CVE-2022-40524 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption due to buffer over-read in Modem while processing SetNativeHandle RTP service. | 7.8 |
2023-09-05 | CVE-2023-21636 | Improper Validation of Array Index vulnerability in Qualcomm products Memory Corruption due to improper validation of array index in Linux while updating adn record. | 7.8 |
2023-09-05 | CVE-2023-21644 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in RIL due to Integer Overflow while triggering qcril_uim_request_apdu request. | 7.8 |