Vulnerabilities > Qualcomm > Wcn3660B Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-12-05 | CVE-2023-28546 | Classic Buffer Overflow vulnerability in Qualcomm products Memory Corruption in SPS Application while exporting public key in sorter TA. | 7.8 |
2023-12-05 | CVE-2023-28550 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in MPP performance while accessing DSM watermark using external memory address. | 7.8 |
2023-12-05 | CVE-2023-28551 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in UTILS when modem processes memory specific Diag commands having arbitrary address values as input arguments. | 7.8 |
2023-12-05 | CVE-2023-28579 | Classic Buffer Overflow vulnerability in Qualcomm products Memory Corruption in WLAN Host while deserializing the input PMK bytes without checking the input PMK length. | 7.8 |
2023-12-05 | CVE-2023-28580 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN Host while setting the PMK length in PMK length in internal cache. | 7.8 |
2023-12-05 | CVE-2023-28588 | Integer Overflow or Wraparound vulnerability in Qualcomm products Transient DOS in Bluetooth Host while rfc slot allocation. | 7.5 |
2023-12-05 | CVE-2023-33017 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Boot while running a ListVars test in UEFI Menu during boot. | 7.8 |
2023-12-05 | CVE-2023-33018 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption while using the UIM diag command to get the operators name. | 7.8 |
2023-12-05 | CVE-2023-33024 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while sending SMS from AP firmware. | 7.8 |
2023-12-05 | CVE-2023-33063 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Services during a remote call from HLOS to DSP. | 7.8 |