Vulnerabilities > Qualcomm > Wcn3660B Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-05-07 | CVE-2021-1891 | Use After Free vulnerability in Qualcomm products A possible use-after-free occurrence in audio driver can happen when pointers are not properly handled in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-05-07 | CVE-2021-1895 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible integer overflow due to improper length check while flashing an image in Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music | 7.8 |
| 2021-05-07 | CVE-2021-1905 | Use After Free vulnerability in Qualcomm products Possible use after free due to improper handling of memory mapping of multiple processes simultaneously. | 7.8 |
| 2021-05-07 | CVE-2021-1906 | Improper Handling of Exceptional Conditions vulnerability in Qualcomm products Improper handling of address deregistration on failure can lead to new GPU address allocation failure. | 5.5 |
| 2021-05-07 | CVE-2021-1910 | Double Free vulnerability in Qualcomm products Double free in video due to lack of input buffer length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |
| 2021-05-07 | CVE-2021-1927 | Use After Free vulnerability in Qualcomm products Possible use after free due to lack of null check while memory is being freed in FastRPC driver in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-04-07 | CVE-2020-11255 | Memory Leak vulnerability in Qualcomm products Denial of service while processing RTCP packets containing multiple SDES reports due to memory for last SDES packet is freed and rest of the memory is leaked in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables | 7.5 |
| 2021-04-07 | CVE-2020-11251 | Out-of-bounds Read vulnerability in Qualcomm products Out-of-bounds read vulnerability while accessing DTMF payload due to lack of check of buffer length before copying in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.1 |
| 2021-04-07 | CVE-2020-11247 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound memory read while unpacking data due to lack of offset length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.1 |
| 2021-04-07 | CVE-2020-11246 | Double Free vulnerability in Qualcomm products A double free condition can occur when the device moves to suspend mode during secure playback in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |