Vulnerabilities > Qualcomm > Wcn3660B Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2025-02-03 | CVE-2024-38404 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS when registration accept OTA is received with incorrect ciphering key data IE in modem. | 7.5 |
| 2025-02-03 | CVE-2024-38416 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure during audio playback. | 5.5 |
| 2025-02-03 | CVE-2024-38417 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while processing IO control commands. | 5.5 |
| 2025-02-03 | CVE-2024-38418 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption while parsing the memory map info in IOCTL calls. | 7.0 |
| 2025-02-03 | CVE-2024-45560 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption while taking a snapshot with hardware encoder due to unvalidated userspace buffer. | 7.0 |
| 2025-02-03 | CVE-2024-45561 | Use After Free vulnerability in Qualcomm products Memory corruption while handling IOCTL call from user-space to set latency level. | 7.8 |
| 2025-02-03 | CVE-2024-45573 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption may occour while generating test pattern due to negative indexing of display ID. | 7.8 |
| 2025-02-03 | CVE-2024-49832 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption in Camera due to unusually high number of nodes passed to AXI port. | 7.8 |
| 2025-02-03 | CVE-2024-49834 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption while power-up or power-down sequence of the camera sensor. | 7.8 |
| 2025-01-06 | CVE-2024-33061 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while processing IOCTL call made for releasing a trusted VM process release or opening a channel without initializing the process. | 5.5 |