Vulnerabilities > Qualcomm > Wcd9390 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-08-05 | CVE-2024-33026 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing probe response and assoc response frame when received frame length is less than max size of timestamp. | 7.5 |
| 2024-08-05 | CVE-2024-33028 | Use After Free vulnerability in Qualcomm products Memory corruption as fence object may still be accessed in timeline destruct after isync fence is released. | 7.8 |
| 2024-08-05 | CVE-2024-33034 | Use After Free vulnerability in Qualcomm products Memory corruption can occur if VBOs hold outdated or invalid GPU SMMU mappings, especially when the binding and reclaiming of memory buffers are performed at the same time. | 7.8 |
| 2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |
| 2024-07-01 | CVE-2024-21465 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption while processing key blob passed by the user. | 7.8 |
| 2024-07-01 | CVE-2024-21469 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when an invoke call and a TEE call are bound for the same trusted application. | 7.8 |
| 2024-07-01 | CVE-2024-23368 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption when allocating and accessing an entry in an SMEM partition. | 7.8 |
| 2024-07-01 | CVE-2024-23372 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption while invoking IOCTL call for GPU memory allocation and size param is greater than expected size. | 7.8 |
| 2024-07-01 | CVE-2024-23373 | Use After Free vulnerability in Qualcomm products Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released. | 7.8 |
| 2024-07-01 | CVE-2024-23380 | Use After Free vulnerability in Qualcomm products Memory corruption while handling user packets during VBO bind operation. | 7.8 |